Interlligent UK’s 2018 RF and Microwave Design Seminar
Presentation Abstracts and Presenter Biographies
Challenges in RF system design for narrow band IoT
Presenter: Olivier van der Aa, HuaweiTechnologies Research & Development
Abstract:
The 3GPP NB-IoT standard will be presented. The narrow band nature of this standard gives several opportunities to design a highly integrated and power efficient solution. The RF challenges that arise from the integration of a power amplifier on chip will be discussed. The presentation will also describe how these challenges can be addressed.
| About the presenter: Olivier vander Aa is the Director of RF Systems at Huawei Technologies Research & Development (UK). After obtaining a PhD in particle physics from « Université catholique de Louvain » in collaboration with CERN Geneva, he moved to Imperial College to develop the LondonGrid computer centre. He then joined Cambridge Silicon Radio working in both radio control software and in the RF lab. He continued working in RF Systems when he joined the Neul startup that was acquired by Huawei 3 years ago. For more information please see Huawei Research & Development. |
Packaged mmWave GaN, GaAs and Si ICs for 5G and automotive radar
Presenter: Eric Leclerc, UMS
Abstract:
The global trend of heterogeneous integration is clearly emerging in RF and millimeter wave solutions in very different domains of applications. Continuous trend for integration requires at a certain level the use of different technologies like GaN, GaAs or Si based for many reasons: multi-functionality, optimized performance, low cost packaging, time to market, volume flexibility. This presentation presents some examples of such multi-technology integration in high volume domains such as radar sensors used in automotive or other applications, 5G FE solutions for 24 to 30 GHz bands integrating LNA and PA with improved drain efficiency or linearity, or eventually also for defense products at lower frequencies. The different challenges induced by this increasing complexity are also discussed, from the technologies selection and design phases, up to evaluation by customers and test in volume optimization
About the presenter: Eric Leclerc joined UMS at its creation in 1996 to work on new power device and GaAs technology development, characterization and modeling. He is presently the field marketing manager within the UMS Marketing and Sales organization. Prior to his current role, Mr. Leclerc was the UMS foundry service manager for several years. Born in France, Eric obtained a research degree in Physics in 1984 and received a Solid State Physics DEA in 1985 at Paris XI University (Orsay). For more information please see: UMS |
Power amplifier MMICs for mmWave 5G
Presenter: Liam Devlin, Plextek RFI
Abstract:
The roll-out of 5G promises a step change in wireless data-rates; one of the main strategies to facilitate this will be a move to mm-wave frequencies where large bands of contiguous spectrum are available. This presentation will describe the design, realisation and evaluation of PAs for a number of the key candidate 5G bands: The European 26GHz Pioneer band (24.25 to 27.5GHz), the FCC licensed band at 28GHz (27.5 to 28.35GHz) and the FCC licensed band at 39GHz (38.6 – 40GHz). Details of the selected process, the key design goals, the topology, the design methodology and the packaging technology used will be presented together with both simulated and measured performance. All parts were SMT packaged with the performance optimised for the packaged PA assembled onto a representative PCB.
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Understanding GaN device trade-offs through advanced load pull simulations
Presenter: Dominic FitzPatrick, PoweRFul Microwave
Abstract:
This paper will look at how the key device performance characteristics can be evaluated at the start of a project through source, fundamental and harmonic load pull, to determine the optimum device choice and amplifier topology
About the presenter:  Dominic FitzPatrick has been involved with the design of solid state RF & Microwave amplifiers for over 30 years. He holds a B.Sc. and M.Sc. (Solid State Microwave Physics) from the University of Portsmouth, England, and a PhD from Cardiff University, Wales. He has been the Technical Director of two UK companies designing and manufacturing SSPAs. Since 2010 he has run Powerful Microwave, a consultancy specialising in the design and manufacture of solid state microwave amplifiers. He is a co-author of “The Handbook of RF and Microwave Power Amplifiers”, Cambridge University Press. For more information please see Powerful Microwave. |
Microwave technology for broadband satellite communications
Presenter: Ralph Green, Airbus Defence and Space
Abstract:
Very high capacity telecommunications satellites (vHTS) need to use relatively broad bandwidth microwave technology payloads. This presentation will provide an overview of the challenges associated with producing communication payload products for today’s Satellite Communications markets to meet the required performance and price. The presentation will address design and implementation aspects of the Microwave Technologies for large Geostationary Platforms down to Smaller Sized Medium and Low Earth Orbit Satellite constellations.
About the presenter: Ralph works in the Space Systems Business Line of Airbus Defence and Space based in Portsmouth UK. He is a member of the Chief Engineer’s Office for Communications Products which is part of the Telecom Satellites business area. He is the RT&D Manager and responsible for coordinating technology strategy and investment for communications products in UK, business development and liaison with external Agencies. For more information please see: Airbus Defence and Space |
Integrated solutions for SatCom on the Move ( and 5G )
Presenter: Moche Cohen, Satixfy UK Limited
Abstract:
The recent advances in IC and PCB design technologies have enabled embracing cellular and connectivity technologies and techniques into SatCom solutions. Efficient solutions, in terms of power and cost, require a holistic approach to designing a terminal.
Satixfy is designing a terminal for COM, adapting a vertical approach while addressing the engineering challenges. By bringing both chip design as well as system design capability under one roof, the technical implementation decisions can be truly optimized.
This presentation will address some of the challenges and proposed design approaches, like system partitioning, feasibility as a tool for identifying and reducing risk, and the use of modern simulation tools to deliver a more deterministic and high-quality end performance.
A typical terminal will require the integration of many different technologies and disciplines. To name a few: System, Algorithms, Software, real time Firmware, Mechanics, PCB , Electromagnetic , Antenna design. By embracing integrated silicon technologies for the core functionalities, in conjunction with modern simulation tools, the development cycle can be made very efficient, modular and re-usable across multiple frequency bands and terminal types.
Starting from the architecture definition, all the way through commercial field trials, a holistic view and understanding of the product allows good decision making and sound engineering, ultimately resulting into a competitive product.
| About the presenter: Moche has been leading Satixfy’s activities in the UK since mid 2016 Moche as VP of R&D focusing on the development of an active phased array antenna for Satcom, based on silicon integrated solutions.Prior to that, Moche was a Director at Broadcom, leading the development of Wireless Backhaul Point-2-Point links and 5G solutions, covering uWave and mmWave frequencies .In the past Moche has participated in the development of new connectivity standards and solutions for the consumer market, mainly WiFi 802.11n which introduced MIMO, and WiGig 802.11ac which introduced phased arrays in 60GHz.Moche holds a Bachelor and Masters degress in Electrical engineering from the Technion Institute of Technology in Israel.Today Moche represents Satixfy as part of his new role as Technical Director in the CTO office, focused on new low power phased array design. For more information please see: Satixfy. |
Design challenges and considerations in the current climate with 5G and CAV
Presenter: Alistair Wingfield, Dassault Systèmes SIMULIA
Abstract:
The role of an RF & Microwave Design Engineer has always been challenging, quite often needing to perform near miracles to ensure connectivity and performance is achieved. Typically, projects need to be completed within challenging deadlines, quite often without too much say in the aesthetics, but taking into account manufacturing challenges. The pace of technology is now dictating faster design times, with ever increasingly complex scenarios and therefore companies are needing to adapt. This talk looks at some of the additional RF & microwave design considerations posed in the Automotive and Hi-Tech industry including a suggested workflow for an Antenna Engineer, and how the RF & Microwave workload is changing in light of an Industrial Renaissance.
About the presenter: Alistair Wingfield joined Dassault Systèmes just under 3 years ago as a Technical Sales Representative, aiding people with their electromagnetic requirements. Prior to this, he spent 8 years in the Defence Industry as an Antenna Design Engineer, concentrating on Antenna and Radomes for fast jet applications. He also spent around 8 years working for Sarantel in the Hi-Tech industry designing and developing miniaturized antennas with low SAR for mobile telecommunications. His PhD from Loughborough University was on low SAR antennas for Mobile telecommunications and he has published around 20 technical papers and won 2 major international awards in the field of Antennas. For more information please see: Dassault Systèmes |
5G mmWave UE Requirements and Implementation Options
Presenter: Konstantinos Mimis, Sony Europe-SES
Abstract:
This talk will review the latest specifications and requirements based on 3GPP status and discuss the range of proposed implementation options.
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About the presenter: Konstantinos Mimis received his |
For more information, contact us on +44 (0)3308 280057 or email info@interlligent.co.uk